<p>There is provided a method for reducing absorptivity of moisture of an insulation film made of SiOF and for achieving a highly reliable semiconductor device. In a method for manufacturing a semiconductor device utilizing a silicon oxide film including fluorine as a layer insulation film of a semiconductor integrated circuit, an inert gas 14 is introduced in addition to source gases 11 - 13 during the formation of the silicon oxide film including fluorine. <IMAGE></p>
申请公布号
EP0788148(A1)
申请公布日期
1997.08.06
申请号
EP19960927864
申请日期
1996.08.21
申请人
ASM JAPAN K.K.;OKI ELECTRIC INDUSTRY COMPANY, LIMITED
发明人
KOIZUMI, SATOSHI, OKI ELECTRIC INDUSTRY CO., LTD.;YOSHIMARU, MASAKI, OKI ELECTRIC INDUSTRY CO., LTD.;MORI, YUKIHIRO, ASM JAPAN K.K.;FUKUDA, HIDEAKI, ASM JAPAN K.K.