发明名称 METHOD OF PRODUCING SEMICONDUCTOR DEVICE
摘要 <p>There is provided a method for reducing absorptivity of moisture of an insulation film made of SiOF and for achieving a highly reliable semiconductor device. In a method for manufacturing a semiconductor device utilizing a silicon oxide film including fluorine as a layer insulation film of a semiconductor integrated circuit, an inert gas 14 is introduced in addition to source gases 11 - 13 during the formation of the silicon oxide film including fluorine. &lt;IMAGE&gt;</p>
申请公布号 EP0788148(A1) 申请公布日期 1997.08.06
申请号 EP19960927864 申请日期 1996.08.21
申请人 ASM JAPAN K.K.;OKI ELECTRIC INDUSTRY COMPANY, LIMITED 发明人 KOIZUMI, SATOSHI, OKI ELECTRIC INDUSTRY CO., LTD.;YOSHIMARU, MASAKI, OKI ELECTRIC INDUSTRY CO., LTD.;MORI, YUKIHIRO, ASM JAPAN K.K.;FUKUDA, HIDEAKI, ASM JAPAN K.K.
分类号 H01L21/316;H01L21/768;C23C16/40;H01L21/31;(IPC1-7):H01L21/316 主分类号 H01L21/316
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