发明名称 |
Polishing apparatus |
摘要 |
<p>A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position. <IMAGE></p> |
申请公布号 |
EP0787561(A1) |
申请公布日期 |
1997.08.06 |
申请号 |
EP19970101800 |
申请日期 |
1997.02.05 |
申请人 |
EBARA CORPORATION |
发明人 |
KIMURA, NORIO;SAKURAI, KUNIHIKO;TOGAWA, TETSUJI;KATSUOKA, SEIJI;NISHI, TOYOMI |
分类号 |
B24B53/007;B24B53/017;(IPC1-7):B24B37/04 |
主分类号 |
B24B53/007 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|