| 摘要 |
PURPOSE: To peel a polyimide insulating layer from its substratum without exerting adverse influence upon a polyimide multilayered wiring board, by forming a thin metal film layer between a substration and a polyimide insulating layer. CONSTITUTION: In the manufacturing method wherein a polyimide multilayered wiring board is formed by dividing it into a plurality of blocks, a thin titanium film layer 2 is formed on a porous ceramics board 1 as an auxilialy substratum by using evaporation. A polyimide multilayered wiring block 3 is formed on the titanium layer 2. When the porous ceramics board 1 is eliminated, after the block is stuck to another multilayered wiring block 4 under the state that heat and pressure are applied, the blocks are dipped into hydrogen peroxide water ammonium solution, and the substratum is eliminated by dissolving the titanium layer. |
