| 摘要 |
A lead-on-chip integrated circuit assembly comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of an integrated circuit chip, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, wherein said lead frame is aligned and connected to integrated circuit chip connection pads. This lead-on-chip integrated circuit assembly may be encapsulated. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the integrated circuit ("IC"). Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated assembly improves the reliability of the integrated circuit package.
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