| 摘要 |
PROBLEM TO BE SOLVED: To polish a substrate at a high accuracy of flatness and parallelism, as well as to maintain the substrate flat. SOLUTION: This polishing device is composed by providing a polishing pad 5 held on a turntable 4; a porous member 3 to suck and hold a substrate 1; and a substrate holder 2 to fix the porous body 3; and to carry out the polishing of the substrate 1 while moving the polishing pad 5 and the substrate 1 relatively, as well as pressure contacting both members oppositely. In this case, the diameter d of the porous member 3 prescribed by filling a seal material to the porous member 3, which is used to suck and hold the substrate 1, is made less than the diameter D of the substrate 1. Consequently, the substrate 1 can be finished at a high accuracy of flatness and parallelism less than a submicron. |
