| 发明名称 |
Semiconductor device having tape automated bonding leads |
| 摘要 |
A plurality of electrode pads are formed on a main surface of a semiconductor chip. The electrode pads on the semiconductor chip are electrically connected to the top end of an inner lead through a metal plating layer.
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| 申请公布号 |
US5654584(A) |
申请公布日期 |
1997.08.05 |
| 申请号 |
US19940344605 |
申请日期 |
1994.11.18 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FUJITSU, TAKAO |
| 分类号 |
H01L21/60;H01L23/04;H01L23/485;H01L23/495;H01L23/498;(IPC1-7):H01L23/415;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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