| 摘要 |
A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including reciprocatory motion drive pulleys provided on the drive shafts of a conveyor. A plurality of wire ropes are installed on the pulleys, and end fittings are attached to the ropes so as to be fitted to the reciprocatory motion drive pulleys. Thus, the positional relationship between the wire ropes and the reciprocatory motion drive pulleys are not changed, and the workpieces are correctly carried by the wire ropes onto heating blocks of the curing device.
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