发明名称 Integrated structure active clamp for the protection of power devices against overvoltages, and manufacturing process thereof
摘要 An integrated structure active clamp for the protection of a power device against overvoltages includes a plurality of serially connected diodes, each having a first and a second electrode, obtained in a lightly doped epitaxial layer of a first conductivity type in which the power device is also obtained; a first diode of said plurality of diodes has the first electrode connected to a gate layer of the power device and the second electrode connected to the second electrode of at least one second diode of the plurality whose first electrode is connected to a drain region of the power device; said first diode has its first electrode comprising a heavily doped contact region of the first conductivity type included in a lightly doped epitaxial layer region of the first conductivity type which is isolated from said lightly doped epitaxial layer by a buried region of a second conductivity type and by a heavily doped annular region of the second conductivity type extending from a semiconductor top surface to said buried region.
申请公布号 US5654225(A) 申请公布日期 1997.08.05
申请号 US19950473792 申请日期 1995.06.07
申请人 CONSORZIO PER LA RICERCA SULLA MICROELETTRONICA NEL MEZZOGIORNO 发明人 ZAMBRANO, RAFFAELE
分类号 H01L27/04;H01L21/822;H01L27/02;H01L27/06;H01L29/78;(IPC1-7):H01L21/265;H01L21/70;H01L27/00 主分类号 H01L27/04
代理机构 代理人
主权项
地址