| 摘要 |
PROBLEM TO BE SOLVED: To provide a packing pad for semiconductor wafer holding which can finish a wafer polishing surface into a mirror surface with a high level of flatness, even when a large diameter of semiconductor wafer is polished. SOLUTION: In a packing pad 1, a wafer holding surface 1a is finished in a flat surface, numerous grooves 2, 2... are formed in a grid form, and those grooves 2 are extended to the outer peripheral end of the packing pad 1. As the material of the packing pad 1, a polyurethane resin porous body having numerous independent bubbles at the inside, for example, can be adopted. All the grooves 2 have the same width and depth, and they are made even in the longitudinal direction. The pitch between grooves is also made even along the whole body of the wafer holding surface 1a. Furthermore, the diameter of the packing pad 1 is set large in order to hold plural sheets of semiconductor wafers W, W,... at a time. |
