| 摘要 |
PROBLEM TO BE SOLVED: To maintain a stable function for a long period by preventing the moisture absorption in a semiconductor device due to the characteristics of an insulating tape and ensuring sufficient moisture resistance by inserting or press injecting a pawl to the opening provided in a heat sink, and fixing a lead frame body to the heat sink. SOLUTION: A plurality of pawls 14 protruding from the rear surface side of a lead frame body 7a are formed at a semiconductor element mount 1, and an opening 15 is formed at a feat sink 8. Since the pawls 14 are inserted or press injected into the opening 15 formed at the heat sink 8 to fix the body 7a to the heat sink 8, an insulating tape is eliminated in the case of fixing. Accordingly, since the moisture absorption does not occur in a semiconductor device due to the characteristics of the tape, the problem of peeling of resin boundary, package crack, or lead corrosion does not occur. Since the expensive material is not required, the manufacturing cost can be reduced. |
