| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste that can be melted and includes no flux compositions, including thermosetting polymers, conductive metal powders, and organic solvents, selected from a group consisting of sulfur, oxygen, nitrogen, silicon, alkali groups, and phenyl groups. SOLUTION: 13wt.%. poly(imide siloxane), 68wt.% particle-size metal silver flakes about 3 to 10μm in length and width and about 1μm thick, and 19wt.% acetophenone are mixed. Conductive pastes 21, 23, produced by mixing this mixture using a high shearing mixer, are made to cling to Cu pads 22, 24 located on an epoxy circuit substrate 20 and from which surface oxides have been removed. Over a pattern composed of two lines of fourteen pads 22, 24, a total of twenty-eight pads, arranged at 1.27-mm intervals, a 28-pin package 25 is attached to the unhardened pastes 21, 23, and after drying they are cured at 220 deg.C for ten minutes. Thus the pastes 21, 23 are converted into a conductive complex material, making electrical connections permanent and increasing the adhesive strength of components to as high as about 0.27kg per lead.
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