| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection reliability between thin-film multilayer wiring layers by securing adhesion strength between a pattern part with a weak adhesion force between a pattern on a substrate and an upper-layer film and the upper-layer film. SOLUTION: Chromium/silicon alloy layer 10 for forming a resistance element and a photo-sensitive polyimide layer 11 for forming a second insulation layer of an upper layer have weak adhesion force and aluminum chelate film 12 is formed as a connection layer between the layers. However, when the aluminum chelate film is formed on an entire surface, a photo-sensitive polyimide layer 11 of the second insulation layer and polyimide layer 9 of a first insulation layer become weak. Therefore, aluminum chelate film 12 is formed as a connection layer only at an interlayer between the chrome/silicon alloy layer 10 for forming the resistance element and the photo-sensitive polyimide layer 11 for forming the second insulation layer. |
