| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to finely form a connector by forming a semicylindrical through hole plated metal film on the wall of an electronic component container, and connecting a plurality of layers of interconnections via the film. SOLUTION: The circuit board comprises an electronic component container 1 formed therethrough, a first interconnection circuit 7 on the surface of the upper side of a circuit board, and a circuit board formed with a second interconnetion circuit 8 on the surface of the rear side of the board. A semicylindrical through hole plated metal film 11 is formed on the wall of the container 1. The circuit 7 is connected to the circuit 8 via the film 11 at the ends. Thus, the circuits 7, 8 formed at the plurality of layers at an interval in the thickness direction are electrically connected by using the wall of the container 1, making it possible to finely form the connector. |
