发明名称 BONDING METHOD BETWEEN WORK AND BASE
摘要 PROBLEM TO BE SOLVED: To make it possible to easily perform complete removal of air bubbles and positioning work by using a transparent material for a base, drilling a hole in the base, superimposing the base on the work, pouring liquid hot wax into the hole and keeping a constant minimum thickness for an adhesive layer. SOLUTION: When adhering a work 10 to the top of a base 20 with hot wax 30, a transparent material is used for the base 20, and a hole 24 is provided in the base 20. Then, the base 20 is placed on the work 10, liquid hot wax 30 is poured to the hole 24, and hot wax is spread to the gaps between the work 10 and the base 20 by capillary phenomenon. For instance, the base 20 can be made of clear quartz glass and a through hole 24 is made at the center from the front to the rear. Then, the base 20 is placed on the work 10, the reference plane 22 is aligned with the edge of the work 10, pressure and heat are applied, hot wax 30 is poured into the hole 24, and cooling is started after confirming that the wax has been spread to the whole surface.
申请公布号 JPH09205126(A) 申请公布日期 1997.08.05
申请号 JP19960031379 申请日期 1996.01.25
申请人 FUJIKURA LTD 发明人 OSAKI TAKUYA;ASANO KENICHIRO;MIKAMI MASAKI;HOSOYA HIDEYUKI
分类号 B29C65/48;C09J5/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B29C65/48
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