| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can be made very small in intrinsic stress and can effectively absorb a stress generated by thermal cycling. SOLUTION: The semiconductor package comprises a semiconductor die 11, a ball grid array, and a printed circuit board 20. The package is designed so that use of 2 sets of solder joints 16 and 26 having different melting points causes its mechanical internal stress to become very small, The joints 26 having the high melting point are provided in a zone of the ball grid array where the highest stress is generating in the resultant package. The joints 16 having the lower melting point are provided in the remaining lower zone of the ball grid array. The ball grid array and printed circuit board 20 are heated to a temperature between the above 2 melting points to be thereby connected each other. |
