| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damaging of electronic parts caused by deformation in the vicinity of a gas jetting-out opening by arranging a plurality of gas jetting-out openings in an inner wall at specified intervals along the carrying direction of the electronic parts and providing a carrier path for carrying the electronic parts along the inner wall by the propelling force of gas jetted out from the gas injecting-out openings. SOLUTION: A discharge shoot rail is divided into two parts, that is, semicircular arc rails 19A and 19B, an integrated circuit 6 is put through an inner hole 24 and the lead 7 of the integrated circuit 6 being carried is drawn out from an opened slit 25. A groove 27 having a specified length and a hole 28 are provided from a part immediately below an air block to a carrying direction in the inner wall front surface of the semicircular arc rail 19A. In the groove 27, an L-shaped air nozzle 29 is arranged such that one end thereof is connected to an air block 26 and the other end is opened in the groove 27. The air jetting- out exit 30 of the other end of the L-shaped air nozzle 29 is opened obliquely toward the inner hole 24 and the integrated circuit 6 is moved by compressed air 31. By arranging the L-shaped air nozzle 29 in the very strong discharge shoot rail, deformation caused by external forces is prevented. |
