发明名称 BOILING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve a heat radiating performance by enhancing coolant circulation. SOLUTION: Defined in a coolant bath made of extruded material 7 are a vapor passage 10 through which coolant flows and boils when receiving heat from an insulated gate bipolar transistor(IGBT) (heater) module, a condensate passage 11 through which condensed solution flows when cooled and liquefied by a radiator, and a heat insulating passage 12 provided between the vapor passage 10 and condensate passage 11. The heat insulating passage 12, which communicates in its lower part with the vapor passage 10 and condense passage 11 and also communicate in its upper part with the vapor passage 10, is filled with the coolant.
申请公布号 JPH09205167(A) 申请公布日期 1997.08.05
申请号 JP19960012410 申请日期 1996.01.29
申请人 DENSO CORP 发明人 KOBAYASHI KAZUO;KAWAGUCHI SEIJI;KADOTA SHIGERU
分类号 H01L23/427;H01L29/739;H01L29/78 主分类号 H01L23/427
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