| 摘要 |
An epoxy resin prepared from a component comprising a bisphenol F having high ortho isomer content is claimed. Ortho isomer content is defined as follows:(A+2B)/2A: content of ortho-para isomer of a bisphenol F O: content of ortho-ortho isomer of a bisphenol F The epoxy resin of the present invention has lower viscosity (e.g. melt viscosity, solution viscosity) and good physical properties (e.g. flexibility), and suitable for various applications such as coating materials, electrical laminates, adhesives, molding products, encapsulation materials, etc.
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