发明名称 |
Modular molding apparatus |
摘要 |
An apparatus is provided for molding lead frames. The apparatus has a mold formed by two mold halves. An assembly for introducing a lead frame into one of the mold halves, an assembly for carrying encapsulating material into the cavities of the mold and an assembly for removing an encapsulated product from the mold are arranged on a carriage movable along a guide relative to the mold halves.
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申请公布号 |
US5654017(A) |
申请公布日期 |
1997.08.05 |
申请号 |
US19950558438 |
申请日期 |
1995.11.16 |
申请人 |
FICO B.V. |
发明人 |
HARMSEN, WILHELMUS HENDRIKUS JOHANNES |
分类号 |
B29C45/40;B29C31/00;B29C37/00;B29C45/14;H01L21/00;H01L21/56;(IPC1-7):B29C45/02;B29C45/17 |
主分类号 |
B29C45/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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