| 发明名称 |
HANDOTAIFUSHOEHOKISHIJUSHISOSEIBUTSUOYOBIHANDOTAISOCHI |
| 摘要 |
An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance. |
| 申请公布号 |
JP2638365(B2) |
申请公布日期 |
1997.08.06 |
| 申请号 |
JP19910335610 |
申请日期 |
1991.11.25 |
| 申请人 |
SHINETSU KAGAKU KOGYO KK |
发明人 |
SHIOBARA TOSHIO;TOMYOSHI KAZUTOSHI;TARUMI YASURO;YAMAGUCHI HIROMASA |
| 分类号 |
C08L63/00;C07D303/22;C07F7/18;C08G59/00;C08G59/14;C08G59/40;C08K5/5419;H01L23/29;H01L23/31;(IPC1-7):H01L23/29;C08K5/54 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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