| 摘要 |
PROBLEM TO BE SOLVED: To form easier an element package requiring no internal volume by providing a first substance having a high coefficient of temperature expansion on an active surface of a micro-electronic element, by cooling, shrinking and forming an opening on an active region of the micro-electronic element which is small and lightweight and has an open region on the electronic element surface. SOLUTION: A first substance 16 is provided on the surface of a SAW die 10 to cover the active region on the SAW die 10. The first substance 16 prevents a second substance 20 from contacting to the active region, eliminate the contamination of the second substance 20, withstands all thermal movements and has a coefficient of thermal expansion larger than that of the second substance 20. SAW die 10 and the first substance 16 are heated to a first predetermined temperature. And the second substance 20 is introduced and guided to set to the first predetermined temperature. The second substance 20 has chemical miscibility with the first substance 16 and SAW die 10, and has a lower coefficient of thermal expansion than the first substance 16. The first substance 16, second substance 20 and SAW die 10 are cooled and a packaged compound element 30 is formed. |
