| 摘要 |
A probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The probe assembly comprises a ball grid probe having connectors mounted onto opposite sides of a circuit board. A first BGA header is mounted to one side of the probe while a first BGA socket is mounted to the other side of the probe. The socket is adapted to receive an integrated circuit which is mounted onto a second BGA header. A second BGA socket is mounted to a printed circuit board and is adapted to receive the ball grid probe via the first BGA header. An interconnection device is provided to electrically couple the ball grid probe to a number of test instruments. |
