| 摘要 |
The smart card has the embedded integrated circuit (2) and face carrying the conductor network (3) covered by a protective layer (6). The protective layer is made locally conductive to form the pattern of the conductor network (3). The conductors are formed above the integrated circuit using a thermo-chemical, mechano-chemical or opto-chemical process. The processes use application of heat to the protective layer, application of mechanical pressure or exposure to light. The card is manufactured by positioning the integrated circuit, applying the protective coating and gluing it in place, then forming the conductor network. |
