发明名称 |
Apparatus and method for depositing particles onto a wafer |
摘要 |
An apparatus for depositing particles onto a wafer comprises a particle generating means; particle size controlling means connected to an output terminal of the particle generating means; a first transmitting tube connected to an output of the particle size controlling means; second and a third transmitting means connected to an output terminal of the first transmitting tube; first counting means connected to an output terminal of the second transmitting tube; particle depositing means connected to an output terminal of the third transmitting means; second counting means connected to the particle depositing means; and a power supplier connected to the particle depositing means. The apparatus and a method for depositing the particles onto the wafer provide a wafer on which particles of known size and kind are deposited. Also, the particles of a different kind and size are deposited on the same wafer.
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申请公布号 |
US5654205(A) |
申请公布日期 |
1997.08.05 |
申请号 |
US19950476113 |
申请日期 |
1995.06.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHAE, SEUNG-KI;AHN, BYUNG-SEOL;HAHM, SANG-KYU;KIM, JONG-SOO |
分类号 |
H01L21/66;G01N21/94;H01L23/544;(IPC1-7):H01L21/66;G01N37/00;G01N15/00;G01B15/02 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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