Separating individual printed circuit boards from stack during manufacture

摘要

The method separates individual circuit boards (6) from a stack (7). The top-most circuit board (6) is picked from the stack (7) and isolated from the stack. The top circuit board or pcb (6) is picked up using clamp elements (45a,45b) which provide an essentially horizontal grip of the opposite sides (6a,6b) of the pcb (6). The pcb (6) is then held or carried away. The device for carrying out this method includes a shaft (5) for holding the stack (7). The shaft has a base (9) on which the stack is arranged. The base (9) is moved up and down by a lifting mechanism (12). The device further includes a grip (36) for the top circuit board (6) and a separating device for each top pcb. The grip (36) includes two clamp elements which are moved towards and away from the top pcb by a drive.