| 摘要 |
PROBLEM TO BE SOLVED: To obtain a temporal package including an external contact having a standard external appearance and high density by providing a base for fixing a die to a base surface of a high density array and an electrical path formed between a contact member on an inter-connector and an external contact on the base. SOLUTION: A package 10 includes a package base 14, an inter-connect 16, and a pressurization mechanism 18. The inter-connect electrically communicates with a package base 14 and a die. The package 14 has a pattern of an internal conductive member 40, and electrically communicates with an external contact formed on a bottom surface of the package base 14. The package 10 holds a semiconductor die and is temporarily electrically connected with the die for testing and burning-in. After the testing, the die is removed from the package 10 and is used as a die passing the test. |
