发明名称 MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a large capacitance with a small area in a method for manufacturing a stacked capacitor cell for constituting a DRAM. SOLUTION: A device has a storage node which is formed in an interlayer insulation film 113 on a semiconductor substrate, contacts the semiconductor substrate, and accumulates electric charge and a stacked capacitor cell consisting of the multilayer body of a cell plate 112 for forming an opposing electrode. In this case, a storage node 109 is in box shape with a wall part being erected on the end face and has a cell plate 112 opposite to the entire bottom surface and at least the inner face of the wall part, thus forming a capacitor.
申请公布号 JPH09199693(A) 申请公布日期 1997.07.31
申请号 JP19970026494 申请日期 1997.02.10
申请人 FUJITSU LTD 发明人 YASHIMA KATSURO;INOUE FUMIHIKO;OGAWA AKINAO
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108 主分类号 H01L27/04
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