APPARATUS AND METHOD FOR ELECTROPLATING A METAL ONTO A SUBSTRATE

摘要

An apparatus (10) adapted for use in the electroplating of a substrate (12) traveling in a substrate direction. The apparatus (10) directs a first fluid stream and a second fluid stream respectively across the first and second width portions of the subtrate (12). The first and second fluid streams do not flow substantially cocurrently with nor countercurrently to the substrate direction.