发明名称 WAFER CARRIER
摘要 <p>PROBLEM TO BE SOLVED: To obtain a wafer carrier suitable for transferring wherein slip at a handle part can be prevented, production efficiency is improved, and products of stable quality can be supplied, by arranging slip prevention means, respectively, on both outside surfaces of a pair of accommodating side walls facing each other. SOLUTION: A pair of accommodating side walls 1a, 1b which are faced in parallel and maintained almost vertically are installed, a plurality of recessed trenches 2a, 2b in which wafers are accommodated almost vertically are arranged on inner surfaces of the accommodating side walls 1a, 1b, and side walls 3a, 3b linking the face-to-face end parts of the accommodating side walls 1a, 1b are installed. Bottom surfaces of the accommodating side walls 1a, 1b are vertically bent toward the inner side to be almost in a J-type. A bottom board 4 wherein recessed trenches 2a, 2b are formed on the bent parts is installed. The almost J-shaped bent part of the bottom board 4 has a notch and is provided with an aperture part in the bottom part, and a wafer is accommodated from the upper part to the lower part. In the above wafer carrier, slip prevention means are arranged on both outside surfaces of a pair of the face-to- face accommodating side walls 1a, 1b. For the slip prevention means, e.g. a plurality of trench parts 5a, 5b are used.</p>
申请公布号 JPH09199580(A) 申请公布日期 1997.07.31
申请号 JP19960285671 申请日期 1996.10.28
申请人 SAMSUNG ELECTRON CO LTD 发明人 KIN BUNKAN;BOKU TOMEI
分类号 B65D85/86;H01L21/673;(IPC1-7):H01L21/68 主分类号 B65D85/86
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