| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board, which is superior in the reliability of the strength of a peel and the like even in a wiring formed in a higher- density and with the high accuracy of a pattern, by a method wherein the throwing power of a primary plating on the roughened surface of a resin insulating layer provided on the board is enhanced. SOLUTION: As a treating liquid for a primary plating, a copper-nickel alloy plating solution containing a hypophosphorous solution and a nickel sulfate, whose concentrations are respectively adjusted in 15 to 20g/1 and 10 to 15g/1, and a plating, whose temperature is adjusted at 55 to 60 deg.C, is used. Herewith, by adding 20 to 50ppm of a lead nitrate or 10 to 60ppm of a potassium ferrocyanide to the plating solution as a stabilizing agent for this plating solution, the diameter of deposited particles from the copper-nickel alloy plating solution, which is the above treating liquid for the primary plating, is controlled into a diameter of 0.5 to 2.0μm, whereby the throwing power of the primary plating on the roughened surface of a resin insulating layer provided on the board can be enhanced. |
