| 摘要 |
PROBLEM TO BE SOLVED: To increase the alignment accuracy and transfer accuracy of a mask and a wafer and thereby increase the productivity without decreasing a throughput by eliminating an alignment error between the mask and the wafer caused by the deformation of a mask membrane when moving a stage in a semiconductor aligner. SOLUTION: This equipment, being provided with a position measuring means which measures a positional relationship between a mask 1 having a mask pattern on a mask membrane 3 and a semiconductor wafer, aligns the mask 1 and the wafer based on the positional relationship between the two and then transfers the mask pattern onto the wafer. When aligning the mask 1 and the wafer, the deformation of the mask membrane 3 in the direction vertical to the mask membrane 3 should be taken into consideration. |
