| 摘要 |
PROBLEM TO BE SOLVED: To perform the peeling in the low temperature condition in a short time, and to prevent the corrosion of a metal thin film provided on a board and peripheral devices, and to lower the toxicity, and to facilitate the waste liquid processing by including the salt composed of hydrofluoric acid and a base, which does not include metal, and water soluble organic solvent and water. SOLUTION: This composition includes (a) salt composed of hydrofluoric acid and a base, which does not include metal, (b) water soluble organic solvent and (c) water, and furthermore, (d) antiseptics at need, and concentration of hydrogen ion (pH) is set at 5-8. As the base, which does not include metal, a base, which does not include metal in a molecule thereof, such as hydroxylamine group, and primary, secondary and tertiary aliphatic amine is used. As the water soluble organic solvent, sulfoxide group such as dimethylsulfoxide is used. In the case where the resist peeling liquid composition includes the (a), (b), (c) components, the (a) component at 0.2-30% by weight, the (b) component at 30-90% by weight and the (c) component as the residual percentage are desirably included. |
