| 摘要 |
PROBLEM TO BE SOLVED: To prevent a processing gas flowing from one of processing chambers into a transportation chamber from adversely affecting a wafer to be processed when the wafer is transported from one processing chamber to another processing chamber through the transportation chamber. SOLUTION: Such a purge gas as Ar is supplied from a gas supply device 18 to a transportation chamber 10, and the chamber 10 is vacuumized by a vacuum pump 16 to keep a vacuum level, e.g. 2×10<-3> Torr of the transportation chamber 10 higher than some or all of vacuum levels of the processing chambers 14a to 14e. Under such condition, when a wafer to be processed is moved between the processing chambers 14a to 14e through the transportation chambers 10 by a robot 12, it can be avoided that a processing gas flows from the processing chambers 14a to 14e in a negative pressure into the transportation chambers 10 in a high pressure.
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