A test head for a semiconductor tester, which facilitates the replacement of a pin card on a printed-circuit board and improves connection reliability of a connector. In a test head for a semiconductor tester, a back-board (1) disposed at a lower portion inside the test head (6) is disposed below and adjacent to a motherboard (2) disposed at an upper portion so as to eliminate disposition of boards at the lower portion. When the pin card (4) is fitted into or removed from the connector (3) of the back board (1), the replacement is carried out in a lower space inside the test head (6).
