| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for effectively preventing crack and warpage and a substrate for mounting IC chips used for it. SOLUTION: A specific part of a glass epoxy substrate 21 for mounting IC chips is penetrated from one surface side to the other surface side and is eliminated for forming an eliminated part 20, one portion of a reverse side which is opposite to a circuit formation surface of an IC chip 3 is fixed to a substrate 21 while the IC chip 3 is located in the region of the eliminated part 20, at the same time one portion 20a of the eliminated part 26 exists around the IC chip 3 in the fixed state, and mold resin 7 is deposited also to the reverse side of the IC chip 3 via the part, thus forming the mold resins 7 and 7a on the front and reverse sides of the IC chip 3 in one piece. |
