METHOD FOR MOUNTING BARE CHIP AND BARE CHIP CARRIER

摘要

A method for mounting a bare chip, by which a series of manufacturing steps from the step of forming bumps on a bare chip to the step of mounting the bare chip on a mounting substrate can be performed with high reliability. At the first step (1301), gold bumps having stud-like shapes are formed on the bare chip by repeating the formation of a gold ball at the end of a gold wire by discharge and cutting the gold wire after the gold ball is connected to an electrode pad on the bare chip by ultrasonic thermocompression bonding. At the second step (1302) of performing screening and burn-in tests, the bare chip is housed in a bare chip carrier and the carrier is attached to a burn-in socket mounted on a burn-in board. The socket is then housed in the chamber of a burn-in device and screening tests etc., on the bare chip are performed. At the time of performing the screening tests, etc., the tops of the bumps are flattened by plastically deforming the tops under pressure. At the step (1303) of mounting the bare chip on the mounting substrate, the bare chip is mounted on the mounting substrate by wire-bonding or flip-chip bonding in a state that the bumps having flattened tops are provided on the bare chip after the bare chip is judged to be acceptable as a result of the screening and burn-in tests.