| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for clearly observing a bump of a chip which is bonded to a glass substrate with an ACF(anisotropic Conductive tape) therebetween without being disturbed by bubbles in the ACF. SOLUTION: Lights are irradiating a glass substrate 11 to which a chip 12 is bonded from a first diagonal direction light source B and a second diagonal direction light source C. Two bright and dark images are obtained by using a camera 32. In each of the two bright and dark images, a portion of a bubble in an ACF looks partly shinning. However, the locations of the portions in the respective images are different from each other. Therefore, the two bright and dark images are synthesized to form an AND image, then the bubbles are quenched so that only a bump for aligning the position is brightly observed.
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