| 摘要 |
PROBLEM TO BE SOLVED: To precisely align a substrate with an imaging surface of an projecting optical system. SOLUTION: A height position of a predetermined area in a wafer W is obtained by an oblique incident AF system. A mark locate at a position different from the predetermined area is observed by a television camera 56 through a projecting lens 18, and a focusing position (the position of a substrate) is obtained from a signal with which the contract becomes highest while an imaging optical path is change. A resist on the mark is removed so that the height position of the mark area is different from that of the predetermined area. This difference in height caused by the difference in structure, is used as an offset which is added to the oblique incident AF system. |
