MULTILAYER FILM FOR FORMING CIRCUIT SUBSTRATE, MULTILAYER CIRCUIT SUBSTRATE USING IT, AND PACKAGE FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve manufacture with a simple process. SOLUTION: A conductor layer 16 is formed in a required wiring pattern 16a, a via hole 18 is formed at a thermo setting resin layer 12 and adhesive layers 14a and 14b provided on both surfaces, and a specific number of multilayer films 10 for forming a circuit substrate with a via 20 where a conductive substance connected to the wiring pattern 16a is filled to the via hole 18 are laminated and thermocompressed to one surface of both surfaces of a core substrate 24 with the via 20 which is formed by filling the conductive substance into the via hole via the adhesive layers 14a and 14b on the surface of the multilayer film 10, and the wiring patterns 16a are electrically connected via the via 20 provided at the multilayer film 10 and the core substrate 24.