| 摘要 |
PROBLEM TO BE SOLVED: To make printing easily on a ceramic base board, retain the shape even after printing, fill through holes in the base board easily to enable fastening, and lower the resistance of the conductor. SOLUTION: Copper, copper oxides, and/or mixture thereof in the form of particulates are dispersed in a highpolymer substance without coagulation to form a highpolymer composite, and thereto copper, copper oxides, and/or mixture thereof having a mean particle size of 1-100nm, a mixture copper powder, and an organic solvent are added, wherein the mixture copper powder chiefly contains base copper powder having a mean particle size of 0.5-10μm to which one sort or more of aux. copper powder having a smaller mean particle size is added.
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