| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wire for switching memory mats being exposed on the main surface of a semiconductor chip from being cracked. SOLUTION: A device consists of a semiconductor chip 3 with a wiring and a bonding pad exposed on a main surface, a lead 2 which is partially insulated and fixed to the main surface of the semiconductor chip via an insulation film 7, a connecting means for electrically connecting the lead and the bonding pad, and a resin sealing body 1 for covering one portion of the semiconductor chip 3 and the lead as well as the connecting means, the tip of the lead protrudes outward from the resin sealing body 1, thus constituting an external terminal. In this case, the lead extended directly above the wiring is partially bent and opposes the wiring with a wider interval than the size of a filler for forming the resin sealing body. |
