| 摘要 |
A plastic package integrated circuit (40) has a heat sink structure with a major surface (11) exposed on a seating plane side (41) of the packaged IC. A puck (10) is attached to a die attach paddle (4) of a lead frame (2). The puck (10) is also electrically attached to a ground point of the IC die (1). The puck (10) comprises a thermally conductive first material combined with a thermal expansion constraining second material providing for improved power dissipation in the plastic packaged IC (40). |
