| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for multilayer printed wiring board use of a structure, wherein a bulge and a peeling are hardly generated between layers in a soldering process in mounting a component. SOLUTION: Prepregs, which are used when more than one sheet of internal layer circuit boards are superposed through the prepregs in such a way that a board for external layer use or a copper foil is arranged on at least one surface of each internal layer circuit board 1 and the circuit boards are thermocompressed and are laminated to constitute integrally the circuit boards, are ones formed by a method wherein a plain glass fiber cloth finished by weaving 337 tex of threads, which consist of a glass fiber of a filament diameter 9μ, at a density of 43 to 45threads/25mm in the longitudinal direction and a density of 35 to 37threads/25mm in the lateral direction is impregnated with a thermosetting resin and is subjected to predrying. |
