| 摘要 |
<p>PROBLEM TO BE SOLVED: To downsize a device even if a wafer is enlarged and prevent lowering of the processing quality of a wafer. SOLUTION: A wafer 1 is supported on a rotatable wafer support base 11. The wafer support base 11 is movable in an X-axis direction by a support base moving machine 13. A dicing blade 14 for dicing the wafer 1 is movable in Y-axis and X-axis directions by a dicing blade moving mechanism 15, respectively. The maximum stroke in the X-axis direction of the wafer support base 11 is identified to a diameter D of the wafer 1 and the maximum stroke (moving distance) Sy in the Y-axis direction of the dicing blade 14 is set to be D/2>=Sy<D. Each cutting by the dicing blade 14 in the X and Y directions of the wafer 1 is performed twice, for example by halves.</p> |
