| 摘要 |
PROBLEM TO BE SOLVED: To remove a projection and a rise higher than other portions, generated at a pattern edge portion, when wet etching has been performed on a polyimide resin film formed on a substrate and heat processing has been performed on the polyimide resin film to imidize the film. SOLUTION: A polyimide resin film 4 is formed on a substrate 1, and masked with a positive resist 7. Wet etching is performed on the polyimide resin film 4 by using alkali aqueous solution, and the positive resist 7 is removed by using an organic solvent. Further, additional wet etching is performed by using a solvent which dissolves an edge portion of N-methyl-2-pyrrolidone. |
