| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a device container and simultaneously simplify use and treatment of a semiconductor device by forming a support part for fixing a semiconductor chip as an upper part of the device container, and further forming an electrode terminal having a terminal contact as a side surface of the device container. SOLUTION: A container 15 of a semiconductor device 1 includes two electrode terminals 17 having terminal contacts 16 and used as opposite side surfaces of the device container 15. A support part 8 forms a container upper part for closing the device container 15 upwardly, and surrounds a semiconductor chip 2 together with the two container side surfaces for protection of the same. An electrode terminal of a semiconductor device which terminal is provided for electric contact with a printed board, etc., is simultaneously used as a constituent part of the device container in such a manner, whereby a semiconductor device container is sharply miniaturized compared with conventional container configuration. Further, mechanical and thermal stability is ensured for the use and handling of a semiconductor device. |
