| 摘要 |
<p>An optical scanner (22) scanning disks (2) or other materials connected to a microscope (32, 35-38) or other inspection device, providing the location of defects, flaws and events to the microscope (32, 35-38), facilitating defect location and analysis. In some embodiments, the microscope (32, 35-38) may be replaced with an electron microscope or an atomic force microscope, or other advanced image analysis. In some embodiments, information regarding the defect is provided to a manufacturing function automatically and quickly, thus preventing problems that might arise due to delays in communication. In some embodiments the disks (2) on which defects are found are physically moved to a remote microscope location, while in other embodiments the scanner (22) and microscope (32, 35-38) are located along the path (57) on which all disks (2) are transported.</p> |
