| 摘要 |
PURPOSE:To realize change of a pattern on a substrate without being affected by high density package regarding a wiring connection method for changing connection of a pattern which is once formed such as wiring repair when something is wrong with an inner layer pattern which is connected on a substrate and a wiring modification. CONSTITUTION:In a wiring connection method of a pattern connected to a through-hole 3 formed on a substrate 1, pins 6, 8 which are selectively different in accordance with the state of a pattern are pressed into the through-hole 3. When the pattern is normal, the conductive pin 8 is pressed into, when the pattern is abnormal, the conductive pin 6 is pressed into through an insulator 5 which insulates electrical connection with the through-hole and a discrete wire 7 is joined to a wire bonding pad 4 formed in the pin 6 to enable an arbitrary wiring treatment. |
