| 摘要 |
PURPOSE:To obtain a high-reliability and high-yield semiconductor device which enhances the bonding strength between a copper-foil shield layer for the semiconductor device and a bonding layer so as to prevent the shield layer form being stripped in a soldering operation. CONSTITUTION:An insulating layer 2 is formed on the surface of an aluminum base plate 1; a power device part including a semiconductor element 7 is constituted on the insulating layer 2. When a glass epoxy substrate 10 which is provided with a copper-foil shield layer 9 and copper-foil wiring on both faces is bonded, by using a bonding layer 8, to another region on the insulating layer 2, it is bonded by laying a glass epoxy layer 17 between the bonding layer 8 and the glass epoxy substrate 10. |
