发明名称 |
Thermally enhanced ball grid array package |
摘要 |
Thermally enhanced electronic package (30) has a first electronic component (32) and a number of discrete connectors (36) bonded to a thermally conductive member (34) having a first coefficient of thermal expansion. The connectors have at least one coefficient of thermal expansion different from the first and have fusible conductors (38) on at least one surface and conductive passageways, the electronic component being electrically connected to the passageways in the members and via them to the fusible conductors. |
申请公布号 |
EP0747952(A3) |
申请公布日期 |
1997.07.30 |
申请号 |
EP19960107832 |
申请日期 |
1996.05.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WILSON, JAMES WARREN;ENGLE, STEPHEN ROBERT;MOORE, SCOTT PRESTON |
分类号 |
H01L21/60;H01L23/12;H01L23/13;H01L23/36;H01L23/367;H01L23/373;H01L23/498 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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